NSI50350AST3G
http://onsemi.com
7
PACKAGE DIMENSIONS
SMC
CASE 40303
ISSUE E
DIM
A
MIN
NOM
MAX
MIN
MILLIMETERS
1.90
2.13
2.41
0.075
INCHES
A1
0.05
0.10
0.15
0.002
b
2.92
3.00
3.07
0.115
c
0.15
0.23
0.30
0.006
D
5.59
5.84
6.10
0.220
E
6.60
6.86
7.11
0.260
L
0.76
1.02
1.27
0.030
0.084
0.095
0.004
0.006
0.118
0.121
0.009
0.012
0.230
0.240
0.270
0.280
0.040
0.050
NOM
MAX
7.75
7.94
8.13
0.305
0.313
0.320
HE
4.343
0.171
3.810
0.150
2.794
0.110
mm
inches
SCALE 4:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
b
D
c
L1
L
A1
A
NOTES:
1.  DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2.  CONTROLLING DIMENSION: INCH.
3.  D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4.  403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.
H
E
0.020 REF
0.51 REF
L1
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